High Temperature Resistance JEDEC Matrix Tray for IC Component
The JEDEC tray is also known as "matrix" tray, which is mainly used to transport and store some components in the electronics industry. Transporting the components in the tray is a challenge for many companies in the semiconductor industry. Customer products are often very fragile and may be damaged in transportation and handling collisions. Even the slightest collision can move a product and lead to a shortened life. So it is very important to choose a suitable tray for customer. Our Hiner-pack can provide the most perfect packaging solution according to the products, so customers don't have to worry about transportation.
The Details of HN22042 JEDEC Tray
HN22042 JEDEC tray is made of industrial plastic injection molding, the most common product color is black. Black tray is dirt resistant and relatively low production cost. According to customer needs to choose different materials, there are many other colors for customers to choose, such as blue, white, green and so on.
The matrix tray is mainly used for automated testing and assembly processes. Typical temperature ratings for baking JEDEC trays are 140°C, 150°C, and 180°C. The higher the temperature, the higher the corresponding tray manufacturing cost. It is designed with a 45 degree chamfer, providing an intuitive indication of the product pin direction. This design prevents error stacking, reduces the possibility of worker error and maximizes chip protection.
| Outline Line Size | 322.6*135.9*12.19mm | Brand | Hiner-pack |
| Model | HN22042 | Package Type | N/A |
| Cavity Size | 12.6*22.4*1.45mm | Matrix QTY | 6*10=60PCS |
| Material | PES | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application of the HN21142 Matrix Tray
Semiconductor Sensor
Optical Industry Military Industry
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized |
Service
1.We have sample stock, also can help the client to choose which type is suitable for them.
2.We will reply you in any time if you have questions.
3.Choose suitable product for clients according to clients' requirement.
4.After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.
5.We offer ESD total Solution to Customer, Many other related product available if needed.
6.OEM is welcomed or design as customer request.
FAQ
Q1: Are You Manufacturer or Trade Company?
Reply:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
Reply:ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Reply:Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Reply:Let us know the size of your IC or component thickness,and then we can make a quotation for you
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.
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